Yoni Xiong

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About Me

Hi! Welcome to my website. I am an Electrical Engineering PhD student at Vanderbilt University in Nashville, TN. My anticipated graduation date is in Fall 2025. My research is focused on radiation effects and reliability on microelectronics. I evaluate single event effects (SEE) on highly advanced technology nodes like the 3-nm bulk FinFET CMOS node. My personal interests include watercolor painting, fiber arts, photography, badminton, and pickleball. Please check out my LinkedIn if you are interested in connecting!

Journal Publications

1. Y. Xiong, N. J. Pieper, J. B. Kronenberg, D. R. Ball, N. A. Dodds and B. L. Bhuva, "Comparative Study of RHBD Techniques at a 3-nm Bulk FinFET Node,," in IEEE Transactions on Nuclear Science, doi: 10.1109/TNS.2025.3552051.
2. N. J. Pieper, Y. Xiong, J. B. Kronenberg, J. Pasternak, D. R. Ball and B. L. Bhuva, "SEU Vulnerability of SRAM Designs at a 3nm Bulk FinFET Node,," in IEEE Transactions on Nuclear Science, doi: 10.1109/TNS.2025.3539979.
3. J. B. Kronenberg, N. J. Pieper, Y. Xiong, D. R. Ball, and B. L. Bhuva, "Single-Event Upsets Due to n-Hits and p-Hits at the 3nm Bulk FinFET Node,," in IEEE Transactions on Nuclear Science, Early Access, doi: 10.1109/TNS.2025.3528740.
4. Y. Xiong, N. J. Pieper, J. B. Kronenberg, M. Delaney, C. Nunez, D. R. Ball, M. Casey, R. Fung, S. Wen, and B. L. Bhuva, "SEU Cross-Section Trends for Threshold Voltage Options from 16-nm to 3-nm Bulk FinFET Nodes,," in IEEE Transactions on Nuclear Science, vol. 72, no. 4, pp. 1479-1485, April 2025, doi: 10.1109/TNS.2024.3513215.
5. J. B. Kronenberg, N. J. Pieper, Y. Xiong, C. N. N. Sanchez, D. R. Ball and B. L. Bhuva, "Single-Event Responses of Dual-and Triple-well Designs at the 5nm Bulk FinFET Node,," in IEEE Transactions on Nuclear Science, vol. 72, no. 4, pp. 1358-1364, April 2025, doi: 10.1109/TNS.2025.3545001.
6. N. J. Pieper, Y. Xiong, J. Kronenberg, C. Nunez Sanchez, M. Delaney, D. Ball, M. Casey, R. Fung, and B. L. Bhuva, "Multicell Upsets in Flip-Flops in Advanced FinFET Nodes,," in IEEE Transactions on Nuclear Science, vol. 72, no. 4, pp. 1496-1503, April 2025, doi: 10.1109/TNS.2024.3521007.
7. C. N. Nuñez Sanchez, N. J. Pieper, Y. Xiong, J. B. Kronenberg, D. R. Ball and B. L. Bhuva, "Evaluation of Fin Geometry and Threshold Voltage Variants on Single-Event Effects in 7-, 5-, and 3-nm Bulk FinFET Technologies,," in IEEE Transactions on Nuclear Science, vol. 72, no. 4, pp. 1395-1402, April 2025, doi: 10.1109/TNS.2024.3503495.
8. Y. Xiong, N. J. Pieper, J. B Kronenberg, Y. Chiang, R. Fung, S.-J. Wen, and B. L Bhuva, "Evaluation of Threshold Frequencies for Logic Single-Event Upsets at Bulk FinFET Technology Nodes,," in IEEE Transactions on Nuclear Science, vol. 71, no. 8, pp. 1675-1681, Aug. 2024, doi: 10.1109/TNS.2024.3365474.
9. Y. Xiong, N. J. Pieper, N. A. Dodds, G. Vizkelethy, R. N. Nowlin, and B. L. Bhuva, "Response of 5-nm Bulk FinFET SRAMs to Extreme Ionizing and Non-ionizing Doses,," in IEEE Transactions on Nuclear Science, vol. 71, no. 4, pp. 437-445, April 2024, doi: 10.1109/TNS.2023.3334997.
10. N. J. Pieper, Y. Xiong, J. Pasternak, D. R. Ball, and B. L. Bhuva, "Effects of TID on SRAM Data Retention Stability at the 5-nm Node,," in IEEE Transactions on Nuclear Science, vol. 71, no. 8, pp. 1864-1871, Aug. 2024, doi: 10.1109/TNS.2023.3346178.
11. Y. Xiong, N. J. Pieper, Y. Qian, S. E. Wodzro, B. Narasimham, R. Fung, S.-J. Wen, and B. L. Bhuva, "Single-Event Upset Cross-Section at High Frequencies for RHBD Flip Flop Designs at the 5-nm Bulk FinFET Node,," in IEEE Transactions on Nuclear Science, vol. 71, no. 4, pp. 839-844, April 2024, doi: 10.1109/TNS.2023.3339329.
12. N. J. Pieper, Y. Xiong, J. Pasternak, R. Fung, S.-J. Wen, D. R. Ball, and B. L. Bhuva, "Temperature Dependence of Critical Charge and Collected Charge in 5-nm FinFET SRAM,," in IEEE Transactions on Nuclear Science, vol. 71, no. 4, pp. 861-868, April 2024, doi: 10.1109/TNS.2023.3336233.
13. Y. Qian, N. J. Pieper, Y. Xiong, J. Pasternak, D. R. Ball, and B. L. Bhuva, "SRAM Electrical Variability and SEE Sensitivity at 5-nm Bulk FinFET Technology,," in IEEE Transactions on Nuclear Science, vol. 71, no. 4, pp. 663-669, April 2024, doi: 10.1109/TNS.2023.3326797.
14. Y. Xiong, N. J. Pieper, M. W. McCurdy, D. R. Ball, B. D. Sierwaski, and B. L. Bhuva, "Evaluation of the Single-Event-Upset Vulnerability for Low-Energy Protons at the 7- and 5-nm Bulk FinFET Nodes,," in IEEE Transactions on Nuclear Science, vol. 70, no. 8, pp. 1687-1693, Aug. 2023, doi: 10.1109/TNS.2023.3246085.
15. Y. Xiong, N. J. Pieper, B. Narasimham, D. R. Ball, and B. L. Bhuva, "Efficacy of Spatial and Temporal RHBD Techniques at Advanced Bulk FinFET Technology Nodes,," in IEEE Transactions on Nuclear Science, vol. 70, no. 8, pp. 1814-1820, Aug. 2023, doi: 10.1109/TNS.2023.3246067.
16. N. J. Pieper, Y. Xiong, J. Pasternak, N. A. Dodds, D. R. Ball, and B. L. Bhuva, "Single-Event Upsets for Single-Port and Two-Port SRAM Cells at the 5-nm FinFET Technology,," in IEEE Transactions on Nuclear Science, vol. 70, no. 8, pp. 1673-1679, Aug. 2023, doi: 10.1109/TNS.2023.3240979.
17. Y. Xiong, N. J. Pieper, A. T. Feeley, B. Narasimham, D. R. Ball, and B. L. Bhuva, "Single-Event Upset Cross-Section Trends for D-FFs at the 5- and 7-nm Bulk FinFET Technology Nodes,," in IEEE Transactions on Nuclear Science, vol. 70, no. 4, pp. 381-386, April 2023, doi: 10.1109/TNS.2022.3226210.
18. N. J. Pieper, Y. Xiong, A. T. Feeley, J. Pasternack, N. A. Dodds, D. R. Ball, and B. L. Bhuva, "Study of Multicell Upsets in SRAM at a 5-nm Bulk FinFET Node,," in IEEE Transactions on Nuclear Science, vol. 70, no. 4, pp. 401-409, April 2023, doi: 10.1109/TNS.2023.3240318.
19. A.T. Feeley, Y. Xiong, N. J. Pieper, D. R. Ball and B. L. Bhuva, "SE Performance of D-FF Designs with Different VT Options at Near-Threshold Supply Voltages in 7-nm Bulk FinFET Technology,," in IEEE Transactions on Nuclear Science, vol. 69, no. 7, pp. 1582-1586, July 2022, doi: 10.1109/TNS.2022.3169959
20. Y. Xiong, A. T. Feeley, D. R. Ball and B. L. Bhuva, "Modeling Logic Error Single-Event Cross Sections at the 7-nm Bulk FinFET Technology Node,," in IEEE Transactions on Nuclear Science, vol. 69, no. 3, pp. 422-428, March 2022, doi: 10.1109/TNS.2021.3138501.
21. A.T. Feeley, Y. Xiong, N. Guruswamy and B. L. Bhuva, "Effect of Frequency on Total Ionizing Dose Response of Ring Oscillator Circuits at the 7-nm Bulk FinFET Node,," in IEEE Transactions on Nuclear Science, vol. 69, no. 3, pp. 327-332, March 2022, doi: 10.1109/TNS.2022.3144911.
22. Y. Xiong, A. T. Feeley, P. F. Wang, X. Li, E. X. Zhang, L. W. Massengill, and B. L. Bhuva, "Supply Voltage Dependence of Ring Oscillator Frequencies for Total Ionizing Dose Exposures for 7-nm Bulk FinFET Technology,," in IEEE Transactions on Nuclear Science, vol. 68, no. 8, pp. 1579-1584, Aug. 2021.

Personal Projects

tomato scrunchie festival

Crochet Tomato Scrunchie

Crocheted a tomato-themed scrunchie for Nashville Tomato Arts Festival 2025.
Materials: 5mm crochet hook, tapestry needle, red cotton yarn, and green acrylic yarn.
Time: Short project, 1-2 hours
Srunchie Pattern: Double crochet in round with hair tie elastic in the center. [reference]
Leaves Pattern: Foundation chain to desired length (ex. 9 ch). Start in 2nd ch from hook. 1 sc, 1 hdc, 1 dc ,1 dc, 1 tr, 1 dc, 1 dc, turn around. Crochet mirrored on the way back i.e: 1 dc, 1 dc, 1 tr, 1 dc , 1 dc, 1 hdc, 1 sc. 1 sl st in last ch. [reference]
Vines Pattern: 3 single crochets into each chain of foundation chain to create the "curl". Increase or decrease sc per stich to adjust strength of curl. [reference]

Double Crochet Mesh Sweater Double Crochet Mesh Sweater

Double Crochet Mesh Sweater

Crocheted a mesh sweater using thrifted yarn from Nashville Smart Art + Craft Supplies. Perfect for fall-time!
Materials: 6mm crochet hook, tapestry needle, and various blue natural fiber yarn (approx. 8 skeins of sport weight yarn).
Time: Medium project, 18-20 hours
Pattern: See figure for diagram. Both panels worked at the same time to ensure front and back match. Held yarn double or triple to achieve proper thickness and blending between colors. Sleeves can be made with uniform width or with decreases at armpit a more tapered fit. Tapered fit better for short sleeve.

before after

Fused Glass Coaster

Glass (roasted?) goose coaster I made during a creation station event at Vanderbilt Sarratt Studio Arts.
Materials: Various glass, hammer, towel, tweezers, blue elmers gel glue, and safety glasses
Time: Short project, 2 hours
Process: Assemble glass pieces and glue into place. Create smaller pieces as needed using hammer. Tack fuse in kiln.
Notes: Not sure why some of the white glass turned brown, but perhaps some interaction between the glass types.

print collage

Custom New 3DS Cover Plates

Customizable cover plates were a unique feature of the standard "New 3DS" console. However, they are now scarce on the aftermarket and often expensive. To address this, I designed, 3D printed, sanded, and painted custom cover plates for the console.
Materials: 3D printer, wood filler, white primer, clear glossy finish, acrylic paint, and sand paper of various grits.
Time: Long project, 2 weeks
Process: Purchased an OEM cover plate as reference. Measured the dimensions with calipers and designed in Fusion 360. Printed test strips to check dimensions and fit of different sections. Processed 3D print with sand paper and wood filler to remove any grooves created by the printer. Sprayed white primer as base. Painted with acrylic paint. Sealed paint with clear gloss.

Curriculum Vitae

By request via LinkedIn